K6X275, K6X4008, K6X40081C-GB70 Selling Leads, Datasheet
MFG:PHI Package Cooled:DIP 32 D/C:08+
K6X275, K6X4008, K6X40081C-GB70 Datasheet download
Part Number: K6X275
MFG: PHI
Package Cooled: DIP 32
D/C: 08+
MFG:PHI Package Cooled:DIP 32 D/C:08+
K6X275, K6X4008, K6X40081C-GB70 Datasheet download
MFG: PHI
Package Cooled: DIP 32
D/C: 08+
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: K6X0808C1D
File Size: 170625 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K6X4008C1F
File Size: 181493 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: K6X0808C1D
File Size: 170625 KB
Manufacturer: SAMSUNG [Samsung semiconductor]
Download : Click here to Download