MFG:ON Package Cooled:SOP 8 D/C:SOP/8
MMDF6N02HDR2(D6N02), MMDF6N03DR2, MMDF6N03HD Datasheet download
MFG: ON
Package Cooled: SOP 8
D/C: SOP/8
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PDF/DataSheet Download
Datasheet: MMDD110T1
File Size: 157687 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MMDD110T1
File Size: 157687 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MMDF6N03HD
File Size: 212374 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
Dual HDTMOS devices are an advanced series of power MOSFETs which utilize Motorola!fls High Cell Density TMO process. These miniature surface mount MOSFETs feature low RDS(on) and true logic level performance. Dual HDTMOS devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applica- tions are dc¤Cdc converters, and power management in portabl and battery powered products such as computers, printers, cellular and cordless phones. They can also be used for low voltage motor controls in mass storage products such as disk drives and tape drives.
|
Rating |
Symbol |
Value |
Unit |
| Drain - Cto - CSource Volta |
VDSS |
30 |
Vdc |
| Gate - Cto - CSource Voltage - Continu |
VGS |
±20 |
Vdc |
| Drain Current - Continuous @TA = 25 Drain Current - Single Pulse (Tp 10 s) |
ID |
6.0 |
Adc |
| Source Current - Continuous @TA = 25 |
IS |
1.7 |
Adc |
| Total Power Dissipation @ TA = 25 (1) |
PD |
2.0 |
Watts |
| Operating and Storage Temperature Range |
TJ ,Tstg |
-55 to 150 |
|
| Single Pulse Drain - Cto - CSource Avalanche Energy - Startin TJ= 25 (VDD = 30 Vdc, VDS = 5.0 Vdc, VL = 20 Vdc, IL = 9.0 Apk, L = 10 mH, RG = 25 ) |
EAS |
325 |
mJ |
| Thermal Resistance - Junction - Cto - CAmbi |
RJA |
62.5 |
/W |
| Maximum Lead Temperature for Soldering Purposes, 1/8 from Case for 10 sec. |
TL |
260 |
` Low RDS(on) Provides Higher Efficiency and Extends Battery Life
` Logic Level Gate Drive !" Can Be Driven by Logic IC
` Miniature SO¤C8 Surface Mount Package !" Saves Board Spa
` Diode Is Characterized for Use In Bridge Circuits
` Diode Exhibits High Speed, With Soft Recovery
` I Specified at Elevated Temperature DSS
` Mounting Information for SO¤C8 Package Provide
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