MP7626KP, MP7626LD, MP7628 Selling Leads, Datasheet
MFG:MP Package Cooled:PLCC D/C:02+
MP7626KP, MP7626LD, MP7628 Datasheet download

Part Number: MP7626KP
MFG: MP
Package Cooled: PLCC
D/C: 02+
MFG:MP Package Cooled:PLCC D/C:02+
MP7626KP, MP7626LD, MP7628 Datasheet download

MFG: MP
Package Cooled: PLCC
D/C: 02+
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PDF/DataSheet Download
Datasheet: MP7626KP
File Size: 120970 KB
Manufacturer: EXAR [Exar Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MP7001
File Size: 155175 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MP7628
File Size: 127531 KB
Manufacturer: EXAR [Exar Corporation]
Download : Click here to Download
The MP7628 is a quad 8-bit Digital-to-Analog Converter designed using a decoded DAC architecture featuring excellent DAC-to-DAC matching and guaranteed monotonicity.
Separate on-chip latches are provided for each DAC to allow easy microprocessor interface.
The readback function allows the user to poll or read the data latches, eliminating the need for storing information in RAM. In the event the microprocessor power supply is interrupted, it can poll the DACs to establish the last known system state.
Data is transferred into any of the four DAC data latches via common 8-bit TTL/CMOS compatible input port. Control inputs DS1, DS2 and A/B determine which DAC is to be loaded. The MP7628's load cycle is similar to the write cycle of a random access memory and the device is bus compatible with most 8-bit microprocessors.
The device operates at +5 V power supply and dissipates less than 5mW.
All DACs offer excellent four quadrant multiplication characteristics with a separate reference input and feedback resistor for each DAC.
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7 V
Digital Input Voltage to GND (2) GND . .0.5 to VDD +0.5 V
IOUT1, IOUT2 to GND (2) GND . . . . . . . .0.5 to VDD +0.5 V
VREF to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .. .+25 V
VRFB to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +25 V
Storage Temperature . . . . . . . . . . . . . 65°C to +150°C
Lead Temperature (Soldering, 10 seconds) . . . . .+300°C
Package Power Dissipation Rating to 75°C
CDIP, PDIP, SOIC, PLCC . . . . . . . . . . . . . . . . . . . . 1050mW
Derates above 75°C . . . . . . . . . . . . . . . . . . . . .14mW/°C
NOTES:
1 Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation at or above this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
2 Any input pin which can see a value outside the absolute maximum ratings should be protected by Schottky diode clamps (HP5082-2835) from input pin to the supplies.

