Package Cooled: DPAK 4 LEAD Single Gauge Surface Mount
D/C: 08+
Description: MOSFET N-CH 60V 24A TO-251A
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Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
TL
260
°C
Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size. 2. When surface mounted to an FR−4 board using the minimum recommended pad size.
NTD24N06 Typical Application
• Power Supplies • Converters • Power Motor Controls • Bridge Circuits