NTD3055LT4, NTD3055VLT4, NTD30N02 Selling Leads, Datasheet
MFG:ON Package Cooled:SOT-252 D/C:04+
NTD3055LT4, NTD3055VLT4, NTD30N02 Datasheet download
Part Number: NTD3055LT4
MFG: ON
Package Cooled: SOT-252
D/C: 04+
MFG:ON Package Cooled:SOT-252 D/C:04+
NTD3055LT4, NTD3055VLT4, NTD30N02 Datasheet download
MFG: ON
Package Cooled: SOT-252
D/C: 04+
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PDF/DataSheet Download
Datasheet: NTD110N02R
File Size: 65651 KB
Manufacturer: ONSEMI [ON Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NTD110N02R
File Size: 65651 KB
Manufacturer: ONSEMI [ON Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NTD30N02
File Size: 54708 KB
Manufacturer: ONSEMI [ON Semiconductor]
Download : Click here to Download
Rating | Symbol | Value | Unit |
Drain−to−Source Voltage | VDSS | 60 | Vdc |
Drain−to−Gate Voltage (RGS = 10 M) | VDGR | 60 | Vdc |
Gate−to−Source Voltage − Continuous − Non−repetitive (tp10 ms) |
VGS VGS |
±20 ±30 |
Vdc |
Drain Current − Continuous @ TA = 100°C − Single Pulse (tp10 s) |
ID IDM |
30 100 |
Adc Apk |
Total Power Dissipation @ TA = 25°C | PD | 75 | W |
Operating and Storage Temperature Range | TJ, Tstg | −55 to 150 |
|
Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 25 Vdc, VGS = 10 Vdc, L = 1.0 mH, IL(pk) = 7.75 A, VDS = 60 Vdc) |
EAS | 313 | mJ |
Thermal Resistance − Junction−to−Case − Junction−to−Ambient (Note 1) − Junction−to−Ambient (Note 2) |
RJC RJA RJA |
1.65 67 120 |
/W |
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds |
TL | 260 |