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Thermal Resistance − Junction−to−Case Total Power Dissipation @ TC = 25°C Drain Current − Continuous @ TC = 25°C, Chip − Continuous @ TA = 25°C, Limited by Wires − Single Pulse (tp 3 10 s)
RJC PD PD ID IDM
3.0 50 45 32 100
°C/W W AAA
Total Power Dissipation @ TA = 25°C Derate above 25°C Total Power Dissipation @ TA = 25°C (Note 1)
PD
71.4 2.1 9.2
°C/W W A
Operating and Storage Temperature Range
TJ, Tstg
−55 to +175
°C
Thermal Resistance − Junction−to−Ambient (Note 2) Total Power Dissipation @ TA = 25°C Drain Current − Continuous @ TA = 25°C
RJA PD lD
100 1.5 7.8
°C/W W A
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds
TL
260
°C
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. When surface mounted to an FR4 board using 0.5 sq. in pad size. 2. When surface mounted to an FR4 board using minimum recommended pad size.
NTD40N03R Features
• Planar HD3e Process for Fast Switching Performance • Low RDS(on) to Minimize Conduction Loss • Low Ciss to Minimize Driver Loss • Low Gate Charge • Optimized for High Side Switching Requirements in High−Efficiency DC−DC Converters • Pb−Free Packages are Available