PACDN2404C, PACDN2408C, PACDN3401C Selling Leads, Datasheet
MFG:RDL Package Cooled:2008 D/C:09+
PACDN2404C, PACDN2408C, PACDN3401C Datasheet download
Part Number: PACDN2404C
MFG: RDL
Package Cooled: 2008
D/C: 09+
PACDN2404C, PACDN2408C, PACDN3401C
- Table of contents:
Info of PACDN2404C
Info of PACDN2408C
Info of PACDN3401C
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About PACDN2404C
PDF/DataSheet Download
Datasheet: PACDN2404C
File Size: 53558 KB
Manufacturer: CALMIRCO [California Micro Devices Corp]
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About PACDN2408C
PDF/DataSheet Download
Datasheet: PACDN2408C
File Size: 765241 KB
Manufacturer: CALMIRCO [California Micro Devices Corp]
Download : Click here to Download
About PACDN3401C
PDF/DataSheet Download
Datasheet: PACDN3401C
File Size: 35571 KB
Manufacturer: CALMIRCO [California Micro Devices Corp]
Download : Click here to Download
PACDN2404C General Description
The PACDN2404C, PACDN2408C and PACDN2416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-to- back zener connections provide ESD protection in cases where nodes with AC signals are present.
These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maxi- mum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge). All I/Os are rated at 18kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30kV.
The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill.
PACDN2404C Features
·4, 8, or 16 transient voltage suppressors in a single package
·In-system Electrostatic Discharge (ESD) protection to 18kV contact discharge per IEC 61000-4-2 international standard
·Compact Chip Scale Package (0.65mm pitch) forma saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages
PACDN2404C Typical Application
·ESD protection of I/O port connections, such as cellular phone, PDA, internet appliance and PC ports
·Protection of interface ports or IC pins which are exposed to high levels of ESD
·ESD protection of analog video and audio R, L, V (right, left, video) ports
·Protection of interface ports or IC pins which are exposed to high levels of ESD
·ESD protection of analog video and audio R, L, V (right, left, video) ports
PACDN2408C General Description
The PACDN2404C, PACDN2408C and PACDN2416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. The back-to- back zener connections provide ESD protection in cases where nodes with AC signals are present.
These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maxi- mum requirements set forth in the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge). All I/Os are rated at 18kV using the IEC 61000-4-2 contact discharge method. Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than 30kV.
The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill.
PACDN2408C Features
·4, 8, or 16 transient voltage suppressors in a single package
·In-system Electrostatic Discharge (ESD) protection to 18kV contact discharge per IEC 61000-4-2 international standard
·Compact Chip Scale Package (0.65mm pitch) forma saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages
PACDN2408C Typical Application
·ESD protection of I/O port connections, such as cellular phone, PDA, internet appliance and PC ports
·Protection of interface ports or IC pins which are exposed to high levels of ESD
·ESD protection of analog video and audio R, L, V (right, left, video) ports
·Protection of interface ports or IC pins which are exposed to high levels of ESD
·ESD protection of analog video and audio R, L, V (right, left, video) ports
PACDN3401C General Description
The PACDN3401C is a transient voltage suppressor that is ideal for very high level protection for sensitive 5V electronic components that may be subjected to electro- static discharge (ESD). The bipolar configuration pro- vides symmetrical ESD protection in cases where nodes with AC signals are present. This device is designed and characterized to safely dissipate ESD strikes at 30kV contact discharge, well beyond the maximum require- ments of the IEC 61000-4-2 international standard (Level 4, 8kV contact discharge).
Using the MIL-STD-883D (Method 3015) specification for Human Body Model (HBM) ESD, signal pins are pro- tected for contact discharges to greater than 30kV.
PACDN3401C Features
·Single channel voltage suppressor in a surface mount EIA standard 0402-sized device
·Compact 0402 size saves board space and eases layout in area critical applications compared to traditional wire bonded IC packages
·In-system ESD protection to over 30kV contact discharge per IEC 61000-4-2 international ESD standard
·Improved electrical characteristics over P0402FC05C Protek devices
·Less than 10|ìA leakage at 5.9
PACDN3401C Typical Application
·Cell phones
·PDAs
·Palmtop PCs
·Notebook PCs
·Set-top box audio and video ports
·Protection of interface ports or IC pins which are exposed to ESD hazards
·PCMCIA cards (PC card)
·PDAs
·Palmtop PCs
·Notebook PCs
·Set-top box audio and video ports
·Protection of interface ports or IC pins which are exposed to ESD hazards
·PCMCIA cards (PC card)
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