PAC002SPFQ

High speed logic devices such as NTL demand unique, high speed bus terminations. The Series/Parallel Termination Network provides 6 terminating channels per package and optimizes signal integrity by reducing reflections and ringing. The termination is in standard values shown below and is ideal for use in NTL buses. The device features a flow through design for the series te minations. Ground-bounce and cross-talk are mini- mized using a proprietary die design which includes multiple die to package connections to the termination  voltage. In addition, the resistors are trimmed to a tight absolute tolerance of 1%, which provides tight imped- ance-matching and results in greatly reduced reflections.

The Series/Parallel Termination Network provides high performance, superior reliability, and low cost through manufacturing efficiency. The termination resistor elements are fabricated using state-of-the-art thin film manufacturing technology, well known for its ability to achieve tight tolerances and precision matching. This integrated solution is silicon-based and has the same reliability characteristics as any of today!s microproces sor products. The thin film resistors have very excellent stability over temperature, applied voltage, and life. In addition, the QSOP industry standard packaging is easy to handle in manufacturing, and enjoys the same high yields as typical semiconductor products.