PBSS5540X135, PBSS5540Z, PBSS5540Z 115 Selling Leads, Datasheet
MFG:NXP Package Cooled:Sot-223 D/C:09+
PBSS5540X135, PBSS5540Z, PBSS5540Z 115 Datasheet download
Part Number: PBSS5540X135
MFG: NXP
Package Cooled: Sot-223
D/C: 09+
MFG:NXP Package Cooled:Sot-223 D/C:09+
PBSS5540X135, PBSS5540Z, PBSS5540Z 115 Datasheet download
MFG: NXP
Package Cooled: Sot-223
D/C: 09+
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PDF/DataSheet Download
Datasheet: PBS400
File Size: 17651 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: PBSS5540Z
File Size: 45501 KB
Manufacturer: PHILIPS [Philips Semiconductors]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: PBS400
File Size: 17651 KB
Manufacturer:
Download : Click here to Download
SYMBOL | PARAMETER | CONDITIONS | MIN. | MAX. | UNIT |
VCBO | collector-base voltage | open emitter | - | -40 | V |
VCEO | collector-emitter voltage | open base | - |
-40 |
V |
VEBO | emitter-base voltage | open collector | - | -6 | V |
IC | collector current (DC) | - | -5 | A | |
ICM | average collector current | - | -10 | A | |
IBM | peak base current | - | -2 | A | |
Ptot | total power dissipation | Tamb 25 °C; note 1 |
- | 1.35 | mW |
Tstg | storage temperature | -65 | +150 | °C | |
Tj | junction temperature | - | 150 | °C | |
Tamb | ambient temperature | -65 | +150 | °C |
Note
1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2. For other mounting conditions, see "Thermal considerations for SOT223 in the General Part of associated Handbook".