RF3376, RF3401E, RF3802 Selling Leads, Datasheet
MFG:RFMD Package Cooled:QFN D/C:New
RF3376, RF3401E, RF3802 Datasheet download

Part Number: RF3376
MFG: RFMD
Package Cooled: QFN
D/C: New
MFG:RFMD Package Cooled:QFN D/C:New
RF3376, RF3401E, RF3802 Datasheet download

MFG: RFMD
Package Cooled: QFN
D/C: New
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: RF3376PCBA-410
File Size: 152954 KB
Manufacturer: RFMD [RF Micro Devices]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: RF3
File Size: 756593 KB
Manufacturer: Willow Technologies Ltd
Download : Click here to Download
PDF/DataSheet Download
Datasheet: RF3802
File Size: 63649 KB
Manufacturer: RFMD [RF Micro Devices]
Download : Click here to Download
The RF3376 is a general purpose, low-cost RF amplifier IC. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as an easily-cascadable 50 gain block. Applications include IF and RF amplification in wireless voice and data communication products operating in frequency bands up to 6000MHz. The device is self-contained with 50 input and output impedances and requires only two external DC-biasing elements to operate as specified.
| Frequency (MHz) | DC to 6000 |
| Gain (dB) | 19.8 at 2000 |
| NF (dB) | 2.0 |
| OP1dB (dBm) | 11.5 |
| OIP3 (dBm) | +24 |
| Vd (V) | 3.4 |
| Vcc (V) | 4.2 |
| Icc (mA) | 35 |
| Package/Size (Dim in mm) | SOT-89 |
The RF3802 is specifically designed for wireless infrastructure applications. Using a highly reliable GaAs HBT fabrication process, this high-performance dual-stage amplifier achieves high output power over a broad frequency range. The RF3802 amplifier also provides excellent efficiency and thermal stability through the use of a thermally-enhanced surface-mount AlN package. Ease of integration is accomplished through the incorporation of an optimized evaluation board design provided to achieve proper 50Ω operation. Various evaluation board bias configurations are available to address a broad range of wireless infrastructure applications:
• AMPS/GSM850/EDGE850
• GSM900/EDGE900
• IS-95/CDMA2000/AMPS

