RFD3N08, RFD3N08L, RFD3N08LSM Selling Leads, Datasheet
MFG:/ Package Cooled:9800 D/C:TO
RFD3N08, RFD3N08L, RFD3N08LSM Datasheet download

Part Number: RFD3N08
MFG: /
Package Cooled: 9800
D/C: TO
MFG:/ Package Cooled:9800 D/C:TO
RFD3N08, RFD3N08L, RFD3N08LSM Datasheet download

MFG: /
Package Cooled: 9800
D/C: TO
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PDF/DataSheet Download
Datasheet: RFD3N08
File Size: 70889 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: RFD3N08L
File Size: 70889 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: RFD3N08LSM
File Size: 70889 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
These N-Channel power MOSFETs are manufactured using a modern process. This process, which uses feature sizes approaching those of LSI integrated circuits gives optimum utilization of silicon, resulting in outstanding performance. They were designed for use in applications such as switching regulators, switching converters, motor drivers, relay drivers and emitter switches for bipolar transistors. This performance is accomplished through a special gate oxide design which provides full rated conductance at gate bias in the 3V to 5V range, thereby facilitating true on-off power control directly from logic level (5V) integrated circuits. Formerly developmental type TA49046.
| RFD3N08L, RFD3N08LSM |
UNITS | |
| Drain to Source Voltage (Note 1) VDSS | 80 | V |
| Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 80 | V |
| Continuous (Figure 2)ID | 20 | A |
| Pulsed Drain Current (Note 3) IDM | Refer to Peak Current Curve | A |
| Gate to Source Voltage VGS | ±10 | V |
Pulsed Drain Current IDM |
Refer to Peak Current Curve |
W |
| Pulsed Avalanche Rating EAS | Figure 6 | |
| Derate above 25oC | 0.2 | A |
| Pulsed Avalanche Rating UIS | Refer to UIS SOA | |
| Operating and Storage Temperature .TJ, TSTG | -55 to 75 | o C |
| Maximum Temperature for Soldering | ||
| Leads at 0.063in (1.6mm) from Case for 10s TL | 300 | o C |
| Package Body for 10s, See Techbrief 334 Tpkg | 260 | o C |
These N-Channel power MOSFETs are manufactured using a modern process. This process, which uses feature sizes approaching those of LSI integrated circuits gives optimum utilization of silicon, resulting in outstanding performance. They were designed for use in applications such as switching regulators, switching converters, motor drivers, relay drivers and emitter switches for bipolar transistors. This performance is accomplished through a special gate oxide design which provides full rated conductance at gate bias in the 3V to 5V range, thereby facilitating true on-off power control directly from logic level (5V) integrated circuits. Formerly developmental type TA49046.
| RFD3N08L, RFD3N08LSM |
UNITS | |
| Drain to Source Voltage (Note 1) VDSS | 80 | V |
| Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 80 | V |
| Continuous (Figure 2)ID | 20 | A |
| Pulsed Drain Current (Note 3) IDM | Refer to Peak Current Curve | A |
| Gate to Source Voltage VGS | ±10 | V |
Pulsed Drain Current IDM |
Refer to Peak Current Curve |
W |
| Pulsed Avalanche Rating EAS | Figure 6 | |
| Derate above 25oC | 0.2 | A |
| Pulsed Avalanche Rating UIS | Refer to UIS SOA | |
| Operating and Storage Temperature .TJ, TSTG | -55 to 75 | o C |
| Maximum Temperature for Soldering | ||
| Leads at 0.063in (1.6mm) from Case for 10s TL | 300 | o C |
| Package Body for 10s, See Techbrief 334 Tpkg | 260 | o C |
