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RFD16N03LSM

Features: • 16A, 30V• rDS(ON) = 0.025W• Temperature Compensating PSPICE™ Model• Can be Driven Directly from CMOS, NMOS,and TTL Circuits• Peak Current vs Pulse Width Curve• UIS Rating Curve• 175oC Operating Temperature• Related Literature- TB334...

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SeekIC No. : 004476506 Detail

RFD16N03LSM: Features: • 16A, 30V• rDS(ON) = 0.025W• Temperature Compensating PSPICE™ Model• Can be Driven Directly from CMOS, NMOS,and TTL Circuits• Peak Current vs Pulse Wid...

RFD16N03LSM Data Sheet

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Part Number:
RFD16N03LSM
Supply Ability:
5000

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  • 1~5000
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  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 16A, 30V
• rDS(ON) = 0.025W
• Temperature Compensating PSPICE™ Model
• Can be Driven Directly from CMOS, NMOS,and TTL Circuits
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
• 175oC Operating Temperature
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"


Specifications

  RFD16N03L, RFD16N03LSM UNITS
Drain to Source Voltage (Note 1) VDSS 30 V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR 30 V
Continuous Drain Current ID 16 A
Pulsed Drain Current (Note 3) IDM 45 A
Gate to Source Voltage VGS ±10 V
EAS
Power Dissipation PD
25oC		 48 W
Pulsed Avalanche Rating EAS Figures 6, 16, 17
Derate above 25oC 0.48 A
Pulsed Avalanche Rating UIS Refer to UIS SOA  
Operating and Storage Temperature .TJ, TSTG -55 to 75 o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL 300 o C
Package Body for 10s, See Techbrief 334 . Tpkg 260 o C



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