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• 15A, 50V • rDS(ON) = 0.150W • Temperature Compensating PSPICE® Model • Peak Current vs Pulse Width Curve • UIS Rating Curve • Related Literature TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFP15P06 Maximum Ratings
RFD15P06, RFD15P06SM, RFP15P06
UNITS
Drain to Source Voltage (Note 1) VDSS
-60
V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR
-60
V
Continuous Drain Current ID
15
A
Pulsed Drain Current (Note 3) IDM
Refer to UIS Curve
A
Gate to Source Voltage VGS
±10
V
Power Dissipation PD 25oC
80
W
Pulsed Avalanche Rating EAS
Figures 6, 16, 17
Derate above 25oC
0.533
A
Pulsed Avalanche Rating UIS
Refer to UIS SOA
Operating and Storage Temperature .TJ, TSTG
-55 to 75
o C
Maximum Temperature for Soldering
Soldering Temperature of Leads for 10s TL
300
o C
Package Body for 10s, See Techbrief 334 Tpkg
260
o C
RFP15P06 Features
• 15A, 60V • rDS(ON) = 0.150W • Temperature Compensating PSPICE® Model • Peak Current vs Pulse Width Curve • UIS Rating Curve • Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"