Purchase RFP12N06RLE, In-stock RFP12N06RLE From SeekIC.
Package Cooled:7850 D/C:Intersil
- Table of contents:
RFP12N06RLE
-
Suppliers
DataSheet
General Description
RFP12N06RLE Maximum Ratings
|
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE |
UNITS | |
|
Drain to Source Voltage (Note 1) VDSS |
60 |
V |
|
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR |
60 |
V |
|
Continuous (Figure 2)ID |
16 |
A |
|
Pulsed Drain Current (Note 3)IDM |
26 |
A |
|
Gate to Source Voltage VGS |
-5 to10 |
V |
|
Power DissipationPD |
40 |
W |
|
Linear Derating Factor |
0.32 |
W/oC |
|
Derate above 25oC |
0.20 |
W/oC |
|
Single Pulse Avalanche Energy RatingEAS |
Refer to UIS SOA Curve |
|
|
Operating and Storage Temperature .TJ, TSTG |
-55 to 75 |
o C |
|
Maximum Temperature for Soldering | ||
|
Leads at 0.063in (1.6mm) from Case for 10s TL |
300 |
o C |
|
Package Body for 10s, See Techbrief 334 Tpkg |
260 |
o C |
RFP12N06RLE Features
• 12A, 60V
• rDS(ON) = 0.135W
• Electrostatic Discharge Protected
• UIS Rating Curve (Single Pulse)
• Design Optimized for 5V Gate Drive
• Related Literature- TB334 "Guidelines for Soldering Surface MountComponents to PC Boards"
• rDS(ON) = 0.135W
• Electrostatic Discharge Protected
• UIS Rating Curve (Single Pulse)
• Design Optimized for 5V Gate Drive
• Related Literature- TB334 "Guidelines for Soldering Surface MountComponents to PC Boards"
RFP12N06RLE
PDF/DataSheet Download
- Datasheet: RFP12N06RLE
- File Size: 50299 KB
- Manufacturer: INTERSIL [Intersil Corporation]
- Click here to Download
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