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RFP12N06RLE

Features: • 12A, 60V• rDS(ON) = 0.135W• Electrostatic Discharge Protected• UIS Rating Curve (Single Pulse)• Design Optimized for 5V Gate Drive• Related Literature- TB334 Guidelines for Soldering Surface MountComponents to PC Boards Specifications RFD...

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RFP12N06RLE: Features: • 12A, 60V• rDS(ON) = 0.135W• Electrostatic Discharge Protected• UIS Rating Curve (Single Pulse)• Design Optimized for 5V Gate Drive• Related Literature...

RFP12N06RLE Data Sheet

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Part Number:
RFP12N06RLE
Supply Ability:
5000

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  • 1~5000
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  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Product Details

Description



Features:

• 12A, 60V
• rDS(ON) = 0.135W
• Electrostatic Discharge Protected
• UIS Rating Curve (Single Pulse)
• Design Optimized for 5V Gate Drive
• Related Literature- TB334 "Guidelines for Soldering Surface MountComponents to PC Boards"


Specifications
RFD12N06RLE,
RFD12N06RLESM,
RFP12N06RLE
UNITS
Drain to Source Voltage (Note 1) VDSS
60
V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR
60
V
Continuous (Figure 2)ID
16
A
Pulsed Drain Current (Note 3)IDM
26
A
Gate to Source Voltage VGS
-5 to10
V

Power DissipationPD

40
W
Linear Derating Factor
0.32
 W/oC
Derate above 25oC
0.20
W/oC
Single Pulse Avalanche Energy RatingEAS
Refer to UIS SOA Curve
Operating and Storage Temperature .TJ, TSTG
-55 to 75
o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s TL
300
o C
Package Body for 10s, See Techbrief 334 Tpkg
260
o C



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