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RFP2N20L, RFP2N80, RFP2P08

Table of contents:
Info of RFP2N20L
Info of RFP2N80
Info of RFP2P08

RFP2N20L, RFP2N80, RFP2P08 Selling Leads, Datasheet

MFG:Intersil Package Cooled:HAR D/C:TO

RFP2N20L, RFP2N80, RFP2P08 Datasheet download

Five Points

Part Number: RFP2N20L

MFG: Intersil

Package Cooled: HAR

D/C: TO

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RFP2N20L Maximum Ratings

	RFP2P20	UNITS
Drain to Source Voltage (Note 1) V_DSS	200	V
Drain to Gate Voltage (RGS = 1MW) (Note 1)V_DGR	200	V
Continuous Drain Current ID	2	A
Pulsed Drain Current (Note 3) I_DM	5	A
Gate to Source Voltage V_GS	±20	V
Maximum Power Dissipation P_D	25	W
Linear Derating Factor	0.2	W/^oCaaa
Operating and Storage Temperature .TJ, T^STG	-55 to 150	^o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL	300	^oC
Package Body for 10s, See Techbrief 334 T_pkg	260	^o C

RFP2N20L Features

• 2A, 200V
• rDS(ON) = 3.500W
• Design Optimized for 5V Gate Drives
• Can be Driven Directly from QMOS, NMOS, TTL Circuits
• Compatible with Automotive Drive Requirements
• SOA is Power Dissipation Limited
• Nanosecond Switching Speeds
• Linear Transfer Characteristics
• High Input Impedance
• Majority Carrier Device
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"

RFP2P08 Maximum Ratings

	RFP2P08	RFP2P10	UNITS
Drain to Source Voltage (Note 1) VDSS	-80	-100	V
Drain to Gate Voltage (RGS = 20kW) (Note 1) VDGR	-80	-100	V
Continuous Drain Current ID	2	2	A
Pulsed Drain Current (Note 3) IDM	5	5	A
Gate to Source Voltage VGS	±20	±20	V
Maximum Power Dissipation PD	25	25	W
Linear Derating Factor	0.2	0.2	W/^oCaaa
Operating and Storage Temperature .TJ, TSTG	-55 to 150	-55 to 150	^o C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL	300	300	^oC
Package Body for 10s, See Techbrief 334 Tpkg	260	260	^o C

RFP2P08 Features

• -2A, -80V and -100V
• rDS(ON) = 3.500W
• Related Literature
- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards

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