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• 4A, 50V and 60V • rDS(ON) = 0.800W • Design Optimized for 5V Gate Drives • Can be Driven Directly from QMOS, NMOS, TTL Circuits • Compatible with Automotive Drive Requirements • SOA is Power-Dissipation Limited • Nanosecond Switching Speeds • Linear Transfer Characteristics • High Input Impedance • Majority Carrier Device • Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFP4N100 Parameters
Technical/Catalog Information
RFP4N100
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
1000V (1kV)
Current - Continuous Drain (Id) @ 25° C
4.3A
Rds On (Max) @ Id, Vgs
3.5 Ohm @ 2.5A, 10V
Input Capacitance (Ciss) @ Vds
-
Power - Max
150W
Packaging
Tube
Gate Charge (Qg) @ Vgs
120nC @ 20V
Package / Case
TO-220AB
FET Feature
Logic Level Gate
Lead Free Status
Contains Lead
RoHS Status
RoHS Non-Compliant
Other Names
RFP4N100 RFP4N100
RFP4N100 General Description
The RFP4N100 and RFP4N100SM are N-Channel enhancement mode silicon gate power field effect transistors. They are designed for use in applications such as switching regulators, switching converters, motor drivers, relay drivers, and drivers for high power bipolar switching transistors requiring high speed and low gate drive power. This type can be operated directly from an integrated circuit.
Formerly developmental type TA09850.
RFP4N100 Maximum Ratings
UNITS
Drain to Source Breakdown Voltage (Note 1)
VDS
1000
V
Drain to Gate Voltage (RGS = 20kW) (Note 1) .
VDGR
1000
V
Continuous Drain Current
ID
4.6
V
Pulsed Drain Current (Note 3)
IDM
17
A
Gate to Source Voltage
VGS
±20
V
Single Pulse Avalanche Rating
EAS
Refer to UIS Curve
mj
(Figures 4, 14, 15)
Maximum Power Dissipation
PD
150
W
Linear Derating Factor
1.2
W/
Operating and Storage Temperature
TJ, TSTG
-55 to 150
Soldering Temperature of Leads for 10s
T L Tpkg
300 260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
RFP4N100 Features
• 4.3A, 1000V • r DS(ON) = 3.500W • UIS Rating Curve (Single Pulse) • -55to 150 Operating Temperature • Related Literature - TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFP4N35 Maximum Ratings
RFM7N35
RFM7N40
RFP7N35
RFP7N40
UNITS
Drain to Source Voltage (Note 1) VDSS
350
400
350
400
V
Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR
350
400
350
400
V
Continuous Drain Current ID
4
4
4
4
A
Pulsed Drain Current (Note 3) IDM
8
8
8
8
A
Gate to Source Voltage VGS
±20
±20
±20
±20
V
Maximum Power Dissipation PD
100
100
100
100
W
Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID
0.6
0.6
0.6
0.6
W/oC
Operating and Storage Temperature .TJ, TSTG
-55 to 150
-55 to 150
-55 to 150
-55 to 150
oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. TL
300
300
300
300
o C
Package Body for 10s, See Techbrief 334 Tpkg
260
260
260
260
o C
RFP4N35 Features
• 4A, 350V and 400V • rDS(ON) = 2.000W • Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"