SBU4S66, SBU6J, SBU8J Selling Leads, Datasheet
MFG:1757 Package Cooled:RHOM D/C:01+
SBU4S66, SBU6J, SBU8J Datasheet download
Part Number: SBU4S66
MFG: 1757
Package Cooled: RHOM
D/C: 01+
SBU4S66, SBU6J, SBU8J
- Table of contents:
Info of SBU4S66
Info of SBU6J
Info of SBU8J
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About SBU10A
PDF/DataSheet Download
Datasheet: SBU10A
File Size: 87732 KB
Manufacturer: Pan Jit International Inc.
Download : Click here to Download
About SBU6J
PDF/DataSheet Download
Datasheet: SBU6J
File Size: 394603 KB
Manufacturer: Diotec Semiconductor
Download : Click here to Download
About SBU8J
PDF/DataSheet Download
Datasheet: SBU8J
File Size: 471411 KB
Manufacturer: Diotec Semiconductor
Download : Click here to Download
SBU6J Maximum Ratings
| PARAMETER (TEST CONDITIONS) |
SYMBOL |
RATINGS |
UNITS | |||||||
| Series Number |
SBU6A |
SBU6B |
SBU6D |
SBU6G |
SBU6J |
SBU6K |
SBU6M |
|||
| Maximum DC Blocking Voltage |
VRM |
50 |
100 |
200 |
400 |
600 |
800 |
100 |
VOLTS | |
| Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
70 | ||
| Maximum Peak Recurrent Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 | ||
| Average Forward Rectified Current |
TC = 100 (Notes 1, 3) |
IO |
6 6 |
AMPS | ||||||
|
TA = 40 (Note 2) | ||||||||||
| Peak Forward Surge Current. Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). TA = 150 |
IFSM |
250 | ||||||||
| Maximum Forward Voltage (Per Diode) at 6 Amps DC |
VFM |
0.95 (Typical < 0.90) |
VOLTS | |||||||
| Maximum Average DC Reverse Current |
@ TA = 25 |
IRM |
1 50 |
A | ||||||
| At Rated DC Blocking Voltage |
@ TA= 100 | |||||||||
| Typical Thermal Resistance |
Junction to Ambient (Note 2 |
RJA RJC |
16.0 3.1 |
°C/W | ||||||
|
Junction to Case (Note 3) | ||||||||||
| Minimum Insulation Breakdown Voltage (Circuit to Case) |
VISO |
2500 |
VOLTS | |||||||
| Operating and Storage Temperature Range |
TJ,TSTG |
-55 to +150 |
°C | |||||||
SBU6J Features
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 250 AMPS PEAK
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
THRU-HOLE FOR EASY HEAT SINK MOUNTING
BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 250 AMPS PEAK
IDEAL FOR PRINTED CIRCUIT BOARD APPLICATIONS
THRU-HOLE FOR EASY HEAT SINK MOUNTING
SBU8J Maximum Ratings
| PARAMETER (TEST CONDITIONS) |
SYMBOL |
RATINGS |
UNITS | |||||||
| Series Number |
SBU8A |
SBU8B |
SBU8D |
SBU8G |
SBU8J |
SBU8K |
SBU8M |
|||
| Maximum DC Blocking Voltage |
VRM |
50 |
100 |
200 |
400 |
600 |
800 |
100 |
VOLTS | |
| Maximum RMS Voltage |
VRMS |
35 |
70 |
140 |
280 |
420 |
560 |
70 | ||
| Maximum Peak Recurrent Reverse Voltage |
VRRM |
50 |
100 |
200 |
400 |
600 |
800 |
1000 | ||
| Average Forward Rectified Current |
TC = 100 (Notes 1, 3) |
IO |
8 |
AMPS | ||||||
| Peak Forward Surge Current. Single 60Hz Half-Sine Wave Superimposed on Rated Load (JEDEC Method). TA = 150 |
IFSM |
400 | ||||||||
| Maximum Forward Voltage (Per Diode) at 6 Amps DC |
VFM |
0.95 (Typical < 0.90) |
VOLTS | |||||||
| Maximum Average DC Reverse Current |
@ TA = 25 |
IRM |
1 50 |
A | ||||||
| At Rated DC Blocking Voltage |
@ TA= 125 | |||||||||
| Typical Thermal Resistance |
Junction to Ambient (Note 2 |
RJA RJC |
16 3 |
°C/W | ||||||
|
Junction to Case (Note 3) | ||||||||||
| Minimum Insulation Breakdown Voltage (Circuit to Case) |
VISO |
2500 |
VOLTS | |||||||
| Operating and Storage Temperature Range |
TJ,TSTG |
-55 to +150 |
°C | |||||||
SBU8J Features
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 400 AMPS PEAK
THRU-HOLE FOR EASY HEAT SINK MOUNTING
BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
SURGE OVERLOAD RATING TO 400 AMPS PEAK
THRU-HOLE FOR EASY HEAT SINK MOUNTING
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