SL32, SL32005, SL3208 Selling Leads, Datasheet
MFG:PLESSEY Package Cooled:DIP D/C:05+
SL32, SL32005, SL3208 Datasheet download
Part Number: SL32
MFG: PLESSEY
Package Cooled: DIP
D/C: 05+
SL32, SL32005, SL3208
- Table of contents:
Info of SL32
Info of SL32005
Info of SL3208
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About SL32
PDF/DataSheet Download
Datasheet: SL32
File Size: 69746 KB
Manufacturer: TRSYS [TRSYS]
Download : Click here to Download
About SL3010
PDF/DataSheet Download
Datasheet: SL3010
File Size: 98360 KB
Manufacturer: SLS [System Logic Semiconductor]
Download : Click here to Download
About SL3010
PDF/DataSheet Download
Datasheet: SL3010
File Size: 98360 KB
Manufacturer: SLS [System Logic Semiconductor]
Download : Click here to Download
SL32 Maximum Ratings
| PARAMETER | CONDITIONS |
Symbol |
MIN. |
TYP. |
MAX. |
UNIT |
| Forward rectified current | See Fig.2 |
IO |
3.0 |
A | ||
| Forward surge current | 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) |
IFSM |
80 |
A | ||
| Reverse current | VR = VRRM TA = 25 |
IR |
1.0 |
mA | ||
| VR = VRRM TA = 100 |
10 |
mA | ||||
| Thermal resistance | Junction to ambient |
RqJA |
50 |
/W | ||
| Diode junction capacitance | f=1MHz and applied 4vDC reverse voltage |
CJ |
300 |
pF | ||
| Storage temperature |
TSTG |
-55 |
+150 |
SL32 Features
·Plastic package has Underwriters Laboratory
·Flammability Classification 94V-O Utilizing Flame
·Retardant Epoxy Molding Compound.
·For surface mounted applications.
·Exceeds environmental standards of MIL-S-19500 / 228
·Low leakage current.
·Flammability Classification 94V-O Utilizing Flame
·Retardant Epoxy Molding Compound.
·For surface mounted applications.
·Exceeds environmental standards of MIL-S-19500 / 228
·Low leakage current.
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