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Peak Pulse Power Dissipation on 10/1000µs waveform (NOTES 1, 2, Fig. 1)
PPPM
Minimum 600
Watts
Peak Pulse Current on 10/1000µs waveform (NOTE 1, Fig. 3)
IPPM
See Table 1
Amps
Power Dissipation on Infinite Heatsink, TA=50°C
PM(AV)
5.0
Watts
Peak Forward Surge Current, 10ms Single Half Sine-wave, Undirectional Only
IFSM
100
Amps
Max. Junction Temperature
TJ
150
°C
Storage Temperature Range
TSTG
-65 to +175
°C
Thermal Resistance Junction to Ambient Air (NOTE 2)
RJA
100
°C/W
Thermal Resistance Junction to Leads
RJL
20
°C/W
SM6T10A Features
For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Repetition Rate (duty cycle): 0.01% Fast reponse time: typically less than 1ps from 0 volts to VBR min. Typical ID less than 1µA above 10V High temperature soldering: 250°C/10 seconds at terminals Plastic package has Underwriters Laboratory Flammability Classification 94V-O
Peak Pulse Power Dissipation on 10/1000µs waveform (NOTES 1, 2, Fig. 1)
PPPM
Minimum 600
Watts
Peak Pulse Current on 10/1000µs waveform (NOTE 1, Fig. 3)
IPPM
See Table 1
Amps
Power Dissipation on Infinite Heatsink, TA=50°C
PM(AV)
5.0
Watts
Peak Forward Surge Current, 10ms Single Half Sine-wave, Undirectional Only
IFSM
100
Amps
Max. Junction Temperature
TJ
150
°C
Storage Temperature Range
TSTG
-65 to +175
°C
Thermal Resistance Junction to Ambient Air (NOTE 2)
RJA
100
°C/W
Thermal Resistance Junction to Leads
RJL
20
°C/W
SM6T12A Features
For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Excellent clamping capability Repetition Rate (duty cycle): 0.01% Fast reponse time: typically less than 1ps from 0 volts to VBR min. Typical ID less than 1µA above 10V High temperature soldering: 250°C/10 seconds at terminals Plastic package has Underwriters Laboratory Flammability Classification 94V-O
