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The STS25NH3LL utilizes the latest advanced design rules of ST's propetary STripFET™ technology. This novel 0.6m process coupled to unique metalization techniques re alizes the most advanced low voltage MOSFET in SO-8 ever produced. It is therefore suit able for the most demanding DC-DC converter applications where high efficiency is to be achived at high output current.
STS25NH3LL Maximum Ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
30
V
VDGR
Drain- gate Voltage (RGS = 20 k)
30
V
VGS
Gate-Source Voltage
± 18
V
ID
Drain Current (continuous) at Tc = 25
25
A
ID
Drain Current (continuous) at Tc = 100
18
A
IDM(`)
Drain Current (pulsed)
100
A
EAS (1)
Single Pulse Avalanche Energy
200
mJ
PTOT
Total Dissipation at Tc = 25
3.2
W
(•)Pulse width limited by safe operating area (1) Starting Tj = 25 ID = 12.5A VDD = 30V
STS25NH3LL Typical Application
· DC-DC CONVERTERS FOR TELECOM AND NOTEBOOK CPU CORE · SYNCHRONOUS RECTIFIER
STS25NH3LL Connection Diagram
STS2DNE60 General Description
This Power MOSFET is the latest development of STMicroelectronis unique "Single Feature Size™" strip-based process. The resulting transisto shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
STS2DNE60 Maximum Ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
60
V
VDGR
Drain- gate Voltage (RGS = 20 k)
60
V
VGS
Gate-Source Voltage
± 20
V
ID
Drain Current (continuous) at Tc = 25 Single Operation
2
A
ID
Drain Current (continuous) at Tc = 100 Single Operation
1.3
A
IDM(`)
Drain Current (pulsed)
8
A
PTOT
Total Dissipation at TC = 25°CDual Operation Total Dissipation at TC = 25°CSingle Operation
2.0 1.6
W W
(`) Pulse width limited by safe operating area.
STS2DNE60 Typical Application
·DC MOTOR DRIVE ·DC-DC CONVERTERS ·BATTERY MANAGMENT IN NOMADIC EQUIPMENT ·POWER MANAGEMENT IN PORTABLE/DESKTOP PCs