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TCE-RS1313, TCET1100, TCET1100G

TCE-RS1313, TCET1100, TCET1100G Selling Leads, Datasheet

MFG:MOT  Package Cooled:MOT  D/C:04+

TCE-RS1313, TCET1100, TCET1100G Picture

TCE-RS1313, TCET1100, TCET1100G Datasheet download

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Part Number: TCE-RS1313

 

MFG: MOT

Package Cooled: MOT

D/C: 04+

 

 

 
 
 
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About TCED1100

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Datasheet: TCED1100

File Size: 212951 KB

Manufacturer: VISAY [Vishay Siliconix]

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About TCET1100

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Datasheet: TCET1100

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Manufacturer: VISAY [Vishay Siliconix]

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About TCET1100G

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Datasheet: TCET1100G

File Size: 188011 KB

Manufacturer: VISAY [Vishay Siliconix]

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TCET1100 General Description

The TCET110. consists of a phototransistor optically coupled to a gallium arsenide infrared-emitting diode in a 4-lead
plastic dual inline package.

The elements are mounted on one leadframe using a coplanar technique, providing a fixed distance between input and output for highest safety requirements.

TCET1100 Maximum Ratings

Coupler
Parameter Test condition
Symbol
Value
Unit
Isolation test voltage (RMS) t = 1 min
VISO
5000
VRMS
Operating ambient temperature range

 
Tamb
- 40 to + 100
Storage temperature range  
Tstg
- 55 to + 125
Soldering temperature 2 mm from case, 10 s
Tsld
260
Input
Reverse voltage  
VR
6
V
Forward current  
IF
60
mA
Forward surge current tp 10 s
IFSM
1.5
mA
Output
Collector emitter voltage  
VCEO
20
V
Emitter collector voltage  
VECO
7
V
Collector current  
IC
20
mA
Collector peak current tP/T = 0.5, tP 10 ms
ICM
100
mW

Notes
(1) Tamb = 25, unless otherwise specified. Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability.

(2) Refer to wave profile for soldering conditions for through hole devices (DIP).

TCET1100 Features

• Extra low coupling capacity - typical 0.2 pF
• High common mode rejection
• Low temperature coefficient of CTR
• CTR offered in 9 groups
• Reinforced isolation provides circuit protection against electrical shock (safety class II)
• Isolation materials according to UL94-VO
• Pollution degree 2 (DIN/VDE 0110/resp. IEC 60664)
• Climatic classification 55/100/21 (IEC 60068 part 1)
• Rated impulse voltage (transient overvoltage)VIOTM = 8 kVpeak
• Isolation test voltage (partial discharge test voltage) Vpd = 1.6 kV
• Rated isolation voltage (RMS includes DC)VIOWM = 600 VRMS
• Rated recurring peak voltage (repetitive)VIORM = 848 Vpeak
• Thickness through insulation 0.75 mm
• Creepage current resistance according to VDE 0303/IEC 60112 comparative tracking index: CTI 175
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TCET1100 Typical Application

• switch-mode power supplies
• line receiver
• computer peripheral interface
• microprocessor system interface
• Circuits for safe protective separation against electrical shock according to safety class II (reinforced isolation):
   - for appl. class I - IV at mains voltage 300 V
   - for appl. class I - III at mains voltage 600 V according to DIN EN 60747-5-5.

TCET1100 Connection Diagram

TCET1100G General Description

Optocoupler, Phototransistor Output, High Temperarure

TCET1100G Maximum Ratings

Coupler
Parameter Test condition
Symbol
Value
Unit
Isolation test voltage (RMS) t = 1 min
VISO
5000
VRMS
Operating ambient temperature range

 
Tamb
- 40 to + 100
Storage temperature range  
Tstg
- 55 to + 125
Soldering temperature 2 mm from case, 10 s
Tsld
260
Input
Reverse voltage  
VR
6
V
Forward current  
IF
60
mA
Forward surge current tp 10 s
IFSM
1.5
mA
Output
Collector emitter voltage  
VCEO
20
V
Emitter collector voltage  
VECO
7
V
Collector current  
IC
20
mA
Collector peak current tP/T = 0.5, tP 10 ms
ICM
100
mW

Notes
(1) Tamb = 25, unless otherwise specified. Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute maximum ratings for extended periods of the time can adversely affect reliability.

(2) Refer to wave profile for soldering conditions for through hole devices (DIP).

TCET1100G Features

• Extra low coupling capacity - typical 0.2 pF
• High common mode rejection
• Low temperature coefficient of CTR
• CTR offered in 9 groups
• Reinforced isolation provides circuit protection against electrical shock (safety class II)
• Isolation materials according to UL94-VO
• Pollution degree 2 (DIN/VDE 0110/resp. IEC 60664)
• Climatic classification 55/100/21 (IEC 60068 part 1)
• Rated impulse voltage (transient overvoltage)VIOTM = 8 kVpeak
• Isolation test voltage (partial discharge test voltage) Vpd = 1.6 kV
• Rated isolation voltage (RMS includes DC)VIOWM = 600 VRMS
• Rated recurring peak voltage (repetitive)VIORM = 848 Vpeak
• Thickness through insulation 0.75 mm
• Creepage current resistance according to VDE 0303/IEC 60112 comparative tracking index: CTI 175
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TCET1100G Typical Application

• switch-mode power supplies
• line receiver
• computer peripheral interface
• microprocessor system interface
• Circuits for safe protective separation against electrical shock according to safety class II (reinforced isolation):
   - for appl. class I - IV at mains voltage 300 V
   - for appl. class I - III at mains voltage 600 V according to DIN EN 60747-5-5.

TCET1100G Connection Diagram

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