W19054, W190HTP, W191 Selling Leads, Datasheet
MFG:WINBOND Package Cooled:DIP D/C:09+ ROHS
W19054, W190HTP, W191 Datasheet download
Part Number: W19054
MFG: WINBOND
Package Cooled: DIP
D/C: 09+ ROHS
MFG:WINBOND Package Cooled:DIP D/C:09+ ROHS
W19054, W190HTP, W191 Datasheet download
MFG: WINBOND
Package Cooled: DIP
D/C: 09+ ROHS
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PDF/DataSheet Download
Datasheet: W194
File Size: 105469 KB
Manufacturer: CYPRESS [Cypress Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: W194
File Size: 105469 KB
Manufacturer: CYPRESS [Cypress Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: W194
File Size: 105469 KB
Manufacturer: CYPRESS [Cypress Semiconductor]
Download : Click here to Download
Stresses greater than those listed in this table may cause permanent damage to the device. These represent a stress rating only. Operation of the device at these or any other conditions above those specified in the operating sections of this specification is not implied. Maximum conditions for extended periods may affect reliability.
Parameter |
Description |
Rating |
Unit |
VDDQ3, VIN |
Voltage on any pin with respect to GND |
0.5 to + 7.0 |
V |
TSTG |
Storage Temperature |
65 to + 150 |
|
TB |
Ambient Temperature under Bias |
55 to + 125 |
|
TA |
Operating Temperature (Commercial) |
0 to + 70 |
|
TA |
Operating Temperature (Industrial) |
40 to + 85 |