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XCR22LV10-15VO24C, XCR22V10, XCR22V10 PC28ACM

Table of contents:
Info of XCR22LV10-15VO24C
Info of XCR22V10
Info of XCR22V10 PC28ACM

XCR22LV10-15VO24C, XCR22V10, XCR22V10 PC28ACM Selling Leads, Datasheet

MFG:XILINX D/C:07+

XCR22LV10-15VO24C, XCR22V10, XCR22V10 PC28ACM Picture

XCR22LV10-15VO24C, XCR22V10, XCR22V10 PC28ACM Datasheet download

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Part Number: XCR22LV10-15VO24C

MFG: XILINX

Package Cooled:

D/C: 07+

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XCR22V10 General Description

The XCR22V10 is the first SPLD to combine high performance with low power, without the need for "turbo bits" or other power down schemes. To achieve this, Xilinx has used their FZP design technique, which replaces conventional sense amplifier methods for implementing product terms (a technique that has been used in PLDs since the bipolar era) with a cascaded chain of pure CMOS gates.

This results in the combination of low power and high speed that has previously been unattainable in the PLD arena. For 3V operation, Xilinx offers the XCR22LV10 that offers high speed and low power in a 3V implementation.

The XCR22V10 uses the familiar AND/OR logic array structure, which allows direct implementation of sum-of-products equations. This device has a programmable AND array which drives a fixed OR array. The OR sum of products feeds an "Output Macro Cell" (OMC), which can be individually configured as a dedicated input, a combinatorial output, or a registered output with internal feedback.

The XCR22V10 implements logic functions as sum-of-products expressions in a programmable -AND/fixed-OR logic array. User-defined functions are created by programming the connections of input signals into the array. User-configurable output structures in the form of I/O macrocells further increase logic flexibility (Figure 1).

XCR22V10 Maximum Ratings

Symbol	Parameter	Min.	Max.	Unit
V_CC	Supply voltage²	0.5	7.0	V
V_I	Input voltage	1.2	V_CC+0.5	V
V_OUT	Output voltage	0.5	V_CC +0.5	V
I_IN	Input current	30	30	mA
I_OUT	Output current	100	100	mA
T_R	Allowale thermal rise ambient to junction	0	75
T_J	Maximum junction temperature	-40	150
T_STG	Storage temperature	-65	150
ESD	Static discharge voltage (human body)	-	1000	V

Notes:
1. Stresses above those listed may cause malfunction or permanent damage to the device. This is a stress rating only. Functional operation at these or any other condition above those indicated in the operational and programming specification is not implied..

XCR22V10 Features

• Industry's first TotalCMOS™ SPLD - both CMOS design and process technologies
• Fast Zero Power (FZP™) design technique provides ultra-low power and high speed
- Static current of less than 75 A
- Dynamic current substantially below that of competing devices
- Pin-to-pin delay of only 7.5 ns
• True Zero Power device with no turbo bits or power down schemes
• Function/JEDEC map compatible with Bipolar, UVCMOS, EECMOS 22V10s
• Multiple packaging options featuring PCB-friendly flow-through pinouts (SOL and TSSOP)
- 24-pin TSOICuses 93% less in-system space than a 28-pin PLCC
- 24-pin SOIC
- 28-pin PLCC with standard JEDEC pinout
• Available in commercial and industrial operating ranges
• Advanced 0.5 E²CMOS process
• 1000 erase/program cycles guaranteed
• 20 years data retention guaranteed
• Varied product term distribution with up to 16 product terms per output for complex functions
• Programmable output polarity
• Synchronous preset/asynchronous reset capability
• Security bit prevents unauthorized access
• Electronic signature for identification
• Design entry and verification using industry standard CAE tools
• Reprogrammable using industry standard device programmers

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