XN1118, XN1119, XN111H Selling Leads, Datasheet
MFG:Panasonic Package Cooled:Sot-153 D/C:08+
XN1118, XN1119, XN111H Datasheet download
Part Number: XN1118
MFG: Panasonic
Package Cooled: Sot-153
D/C: 08+
XN1118, XN1119, XN111H
- Table of contents:
Info of XN1118
Info of XN1119
Info of XN111H
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About XN1118
PDF/DataSheet Download
Datasheet: XN1118
File Size: 35048 KB
Manufacturer: PANASONIC [Panasonic Semiconductor]
Download : Click here to Download
About XN1119
PDF/DataSheet Download
Datasheet: XN1119
File Size: 59247 KB
Manufacturer: PANASONIC [Panasonic Semiconductor]
Download : Click here to Download
About XN111H
PDF/DataSheet Download
Datasheet: XN111H
File Size: 33302 KB
Manufacturer: PANASONIC [Panasonic Semiconductor]
Download : Click here to Download
XN1118 Maximum Ratings
| Parameter | Symbol | Ratings | Unit | |
| Rating of element |
Collector to base voltage | VCBO | -50 | V |
| Collector to emitter voltage | VCEO | -50 | V | |
| Collector current | IC | -100 | mA | |
| Overall | Total power dissipation | PT | 300 | mW |
| Junction temperature | Tj | 150 | ||
| Storage temperature | Tstg | -55 to +150 | ||
XN1118 Features
·Two elements incorporated into one package. (Emitter-coupled transistors with built-in resistor)
· Reduction of the mounting area and assembly cost by one half.
· Reduction of the mounting area and assembly cost by one half.
XN1119 Maximum Ratings
| (E ) |
VCBO | −50 | V |
| (B) |
VCEO | -50 | V |
| IC | -100 | mA | |
| PT | 300 | mW | |
| Tj | 150 | ||
| Tstg | −55 ∼ +150 |
XN1119 Features
` 12 (`)
`
`
XN111H Maximum Ratings
| Parameter | Symbol | Ratings | Unit | |
| Rating of element |
Collector to base voltage | VCBO | -50 | V |
| Collector to emitter voltage | VCEO | -50 | V | |
| Collector current | IC | 100 | mA | |
| Overall | Total power dissipation | PT | 300 | mW |
| Junction temperature | Tj | 150 | ||
| Storage temperature | Tstg | -55 to +150 | ||
XN111H Features
·Two elements incorporated into one package. (Emitter-coupled transistors with built-in resistor)
·Reduction of the mounting area and assembly cost by one half.
·Reduction of the mounting area and assembly cost by one half.
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