Published:2012/11/28 0:34:00 Author:Ecco From:SeekIC
According to Taiwan Semiconductor Manufacturing Co. Ltd., the company has held a groundbreaking ceremony for a fab module at its Fab 14 gigafab at the South Taiwan Science Park in Tainan, Taiwan. And its first fab will mass produce 16-nm FinFET circuits in 2014.
It is reported that building work for phase six of the Fab 14 gigafab is not due to start until 2013 as part of a $17 billion capacity expansion scheduled for the next five years, and the sixth-phase module building is being commenced only seven months after TSMC (Hsinchu, Taiwan) broke ground on phase-five.
Fab 14 phases 5 and 6 are expected to approximately double the manufacturing capacity of the first four phases by offering a total cleanroom area of 87,000 square meters – equivalent to more than 11 soccer fields and four times larger than a typical 300-mm fab.
TSMC co-chief operating officer Chiang Shang-yi also indicated that the factory will be the world’s first 12-inch factory producing 20-nanometer system-on-chips and the first 16-nanometer FinFET chip manufacturing site for TSMC.
Reprinted Url Of This Article: http://www.seekic.com/blog/IndustryNews/2012/11/28/TSMC_increases_building_work_for_FinFET_fab.html
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