Published:2013/2/26 3:06:00 Author:Ecco
At the Mobile World Congress, Intel brings an upgraded 32-nm smartphone processor. Intel indicates that it has made progress since it came to MWC a year ago without any Atom-based smartphone design wins. But the PC giant is still playing catch up in a segment dominated by ARM-based SoCs from Qualcomm, Nvidia and many others. Intel’s Clover Trail+, now shipping, sports three times the graphics of Intel’s cu... (View)
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Published:2013/2/17 3:19:00 Author:Ecco
According to Micron Technology Inc., they have pushed a triple-level cell (TLC) 128-Gbit NAND flash memory in a 20-nm manufacturing process technology. And the company indicates that the technology is the world’s densest memory. At 146 square millimeters the memory die is more than 25 percent smaller than the company’s same-capacity MLC NAND memory and it is intended for use in removable storage, including... (View)
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