03881.5MXEP

The 03881.5MXEP is designed as one kind of lead-free 3AG, METI B fuse device that solves a broad range of application requirements while offering reliable performance and cost-effective circuit protection. Also 03881.5MXEP can be used as supplementary protection in appliance or utilization equipment to provide individual protection for components or internal circuits.

Features of the 03881.5MXEP are:(1) RoHS compliant and Lead-free;(2)designed to Japanese standard JIS C6575;(3)available in cartridge and axial lead form and various forming demensions.

The recommended process parameters of the 03881.5MXEP can be summarized as:(1)Temperature Minimum: 100°C;(2)Temperature Maximum: 150°C;(3)Preheat Time: 60-180 seconds;(4)Solder Pot Temperature: 260°C Maximum;(5)Solder Dwell Time: 2-5 seconds. If you want to know more information about the 03881.5MXEP, please download the datasheet in www.seekic.com or www.chinaicmart.com .