03882.5MXEP

The 03882.5MXEP is designed as one kind of lead-free 3AG, METI B fuse device that solves a broad range of application requirements while offering reliable performance and cost-effective circuit protection. Also this device can be used as supplementary protection in appliance or utilization equipment to provide individual protection for components or internal circuits.

Features of the 03882.5MXEP are:(1) RoHS compliant and Lead-free;(2)designed to Japanese standard JIS C6575;(3)available in cartridge and axial lead form and various forming demensions. And this device is not recommended for IR or Convection Reflow process.

The recommended process parameters of the 03882.5MXEP can be summarized as:(1)Temperature Minimum: 100°C;(2)Temperature Maximum: 150°C;(3)Preheat Time: 60-180 seconds;(4)Solder Pot Temperature: 260°C Maximum;(5)Solder Dwell Time: 2-5 seconds.

The product characteristics of 03882.5MXEP can be summarized as:(1)Materials: Body is Glass and End Caps is Nickelplated brass;(2)Operating Temperature: -55ºC to +125ºC (consider de-rating);(3)Thermal Shock: MIL-STD-202G Method 107 G, Test conditon B:(5 cycles - 65ºC to 125ºC);(4)Vibration: MIL-STD-202G, Method 201A;(5)Salt Spray: MIL-STD-202G, Method 101D, Test Condition B;(6)Solderability: Reference IEC 60127 Second Edition 2003-2001 Annex A. If you want to know more information about the 03882.5MXEP, please download the datasheet in www.seekic.com or www.chinaicmart.com .