THERMAL PAD TO-220 .009" SP1000
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| Series: | Sil-Pad® 1000 | Manufacturer: | Bergquist | ||
| Usage: | TO-220 | Shape: | Rectangular | ||
| Outline: | 19.05mm x 12.70mm | Thickness: | 0.009" (0.229mm) | ||
| Material: | Silicone Based | Propagation Delay Time : | 13.5 ns | ||
| Adhesive: | - | Backing, Carrier: | Fiberglass | ||
| Color: | Pink | Thermal Resistivity: | 0.35°C/W |
| Technical/Catalog Information | 1009-58 |
| Vendor | Bergquist |
| Category | Thermal Management |
| Usage | TO-220 |
| Shape | Rectangular |
| Material | Silicone/Fiberglass |
| Thermal Conductivity | 1.2 W/m-K |
| Thermal Resistivity | 0.35°C/W |
| Thickness | 0.009" (0.229mm) |
| Outline | 19.05mm x 12.70mm |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 1009 58 100958 BER199 ND BER199ND BER199 |