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Part Number: 11-21SYGC/S530-XX/TR8

 

 

 

 

Description: ·The 11-21 SMD Taping is much smaller than lead frame type components, thus ...


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11-21SYGC/S530-XX/TR8 General Description


·The 11-21 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, lightweight makes them ideal for miniature applications. etc.

11-21SYGC/S530-XX/TR8 Maximum Ratings

Parameter Symbol Rating Units
Continuous Forward Current IF 25 mA
Peak Forward Current(Duty 1/10 @ 1KHZ) IFP 60 mA
Reverse Voltage VR 5 V
Operating Temperature Topr -40 ~ +85
Storage Temperature Tstg -40 ~ +90
Soldering Temperature Tsol Reflow Soldering : 260 for 10 sec.
Hand Soldering : 350 for 3 sec.
Power Dissipation Pd 60 mW
Electrostatic Discharge ESD 2000 V

11-21SYGC/S530-XX/TR8 Features

`Package in 8mm tape on 7diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Mono-color type.
`Pb-free.
`The product itself will remain within RoHS complaint version

11-21SYGC/S530-XX/TR8 Typical Application

·Automotive: backlighting in dashboard and switch.
·Telecommunication: indicator and backlighting in telephone and fax.
·Flat backlight for LCD, switch and symbol.
·General use.

11-21SYGC/S530-XX/TR8 datasheet


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