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11-22/R6G6C-A01/2T

Standard LED - SMD Multi Chip LED

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SeekIC No. : 0047937 Detail

11-22/R6G6C-A01/2T: Standard LED - SMD Multi Chip LED

11-22/R6G6C-A01/2T Data Sheet

floor Price/Ceiling Price

US $ .09~.21 / Piece | Get Latest Price
Part Number:
11-22/R6G6C-A01/2T
Mfg:
Everlight
Supply Ability:
5000

Price Break

  • Qty
  • 0~1
  • 1~50
  • 50~100
  • 100~500
  • Unit Price
  • $.21
  • $.17
  • $.12
  • $.09
  • Processing time
  • 15 Days
  • 15 Days
  • 15 Days
  • 15 Days
View more price & deliveries
Total Cost: $ 0.00

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Product Details

Quick Details

LED Size : 3 mm x 2.5 mm x 1.5 mm Illumination Color : Red, Green
Wavelength/Color Temperature : 624 nm, 573 nm Lens Color/Style : Water Clear
Forward Current : 20 mA Forward Voltage : 2 V
Luminous Intensity : 225 mcd, 72 mcd Viewing Angle : 60 deg
Packaging : Reel    

Description

Lens Color/Style : Water Clear
Forward Current : 20 mA
Packaging : Reel
Forward Voltage : 2 V
Illumination Color : Red, Green
Viewing Angle : 60 deg
LED Size : 3 mm x 2.5 mm x 1.5 mm
Wavelength/Color Temperature : 624 nm, 573 nm
Luminous Intensity : 225 mcd, 72 mcd


Features:

`Package in 8mm tape on 7diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Multi-color type.
`Pb-free.
`The product itself will remain within RoHS compliant version.


Application

·Automotive: backlighting in dashboard and switch.
·Telecommunication: indicator and backlighting in telephone and fax.
·Flat backlight for LCD, switch and symbol.
·General use.


Specifications

Parameter
Symbol
Rating
Units
Reverse Voltage
VR
5
V
Forward Current
IF
R6:25
G6:25
mA
Operating Temperature
Topr
-40 To +85
Soldering Temperature
Tsol
260 (for 5 second)
Electrostatic Discharge (HBM)
ESD
2000
V
Power Dissipation
Pd
R6:60
G6:60
mW
Peak Forward Current
(Duty 1/10 @1KHz)
IFP
R6:60
G6:60
mA
Soldering Temperature
Tsol
Reflow Soldering : 260 for 10 sec.
Hand Soldering : 350 for 3 sec.



Description

the 11-22/R6G6C-A01/2T features:

`The 11-22 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
`Besides, lightweight makes them ideal for miniature applications. etc.




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