High Speed / Modular Connectors Z-PACK HS3 HDR 60P
120674-2: High Speed / Modular Connectors Z-PACK HS3 HDR 60P
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Multilayer Ceramic Capacitors (MLCC) - SMD/SMT R 630-CL31C151JBNC CER CHIP 50V NPO 150
Multilayer Ceramic Capacitors (MLCC) - SMD/SMT 50V 22PF 1206 SUB 630-CL31C220JBNC
| Series : | 120674 | Number of Rows : | 6 |
| Number of Positions / Contacts : | 60 | Pitch : | 2 mm |
| Mounting Style : | Through Hole | Termination Style : | Solder Pin |
| Housing Material : | Glass Filled Polyester | Contact Material : | Phosphor Bronze |
| Contact Plating : | Gold over Nickel |
| Technical/Catalog Information | 120674-2 |
| Vendor | Tyco Electronics |
| Category | Connectors |
| Color | - |
| Connector Style | Dual Beam, Center |
| Connector Type | Header, Male Pins, Shrouded |
| Connector Usage | Backplane |
| Contact Finish | Gold |
| Contact Finish Thickness | 30in (0.76m) |
| Contact Layout, Typical | - |
| Features | - |
| Mounting Type | Through Hole |
| Number of Columns | 10 |
| Number of Positions | 60 |
| Number of Rows | 6 |
| Pitch | 0.098" (2.50mm) |
| Termination | Press-Fit |
| Number of Contacts Loaded | All |
| Packaging | Tube |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Compliant by Exemption |
| Other Names | 120674 2 1206742 |