18-225SURSYGC Selling Leads, Price trend, 18-225SURSYGC DataSheet download, circuit diagram from SeekIC.com

Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.Application·Automotive: backlighting in dashboard and switch.·Telecommunication: indicator and backlighting in t...

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SeekIC No. : 004211485 Detail

18-225SURSYGC: Features: `Package in 8mm tape on 7diameter reel.`Compatible with automatic placement equipment.`Compatible with infrared and vapor phase reflow solder process.`Mono-color type.`Pb-free.Application·...

18-225SURSYGC Data Sheet

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Part Number:: 18-225SURSYGC
Supply Ability:: 5000

Price Break

Qty
1~5000

Unit Price
Negotiable

Processing time
15 Days

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Month Sales

268 Transactions

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Upload time: 2025/12/25

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Recent History
What is this?

18-253 evaluate
US $476 - 634.6 / Piece

Circular MIL / Spec Tools, Hardware & Accessories
18-245 evaluate
US $64.15 - 106.92 / Piece

Circular MIL / Spec Tools, Hardware & Accessories
18-225SURSYGC/S530-A4/E4/TR8 evaluate
US $.05 - .12 / Piece

Standard LED - SMD Red/Yellow-Green

Product Details

Description

Features:

`Package in 8mm tape on 7diameter reel.
`Compatible with automatic placement equipment.
`Compatible with infrared and vapor phase reflow solder process.
`Mono-color type.
`Pb-free.

Application

·Automotive: backlighting in dashboard and switch.
·Telecommunication: indicator and backlighting in telephone and fax.
·Flat backlight for LCD, switch and symbol.
·General use.

Specifications

Parameter	Symbol	Rating	Unit
Reverse Voltage	V_R	5	V
Forward Current	I_F	SUR:25 SYG:25	mA
Operating Temperature	T_opr	-40 to +85
Storage Temperature	T_stg	-40 to +90
Soldering Temperature	T_sol	260 (for 5 seconds)
Power Dissipation	P_d	SUR:60 SYG:60	mW
Peak Forward Current (Duty 1/10 @1KHz)	I_FP	SUR:60 SYG:60	mA

Description

·The 18-225SURSYGC SMD Taping is much smaller than lead frame type components, thus enable smaller board size,
higher packing density, reduced storage space and finally smaller equipment to be obtained.
·Besides, lightweight makes them ideal for miniature applications. etc.

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18-225SURSYGC

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