●The 19-217 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained.
●Besides, lightweight makes them ideal for miniature applications. etc.
| Parameter |
Symbol |
Rating |
Unit |
| Reverse Voltage |
VR |
5 |
V |
| Forward Current |
IF |
25 |
mA |
| Peak Forward Current (Duty 1/10 @1KHz) |
IFP |
60 |
mA |
| Power Dissipation |
Pd |
60 |
mW |
| Electrostatic Discharge(HBM) |
ESD |
2000 |
V |
| Operating Temperature |
Topr |
-40~ +85 |
℃ |
| Storage Temperature |
Tstg |
-40~ +90 |
℃ |
| Soldering Temperature |
Tsol |
Reflow Soldering : 260 ℃ for 10 sec. Hand Soldering : 350 ℃ for 3 sec. | |
●Package in 8mm tape on 7〞diameter reel.
●Compatible with automatic placement equipment.
●Compatible with infrared and vapor phase reflow solder process.
●Mono-color type.
●Pb-free.
●The product itself will remain within RoHS complaint version