Features: ·Humidity proof glass·Thermally matched system·No thermal fatigue·No applications restrictions·Sigma BondTM plated contacts·100% guaranteed solderability·Problem free assembly·Six Sigma quality·LL-35 MiniMELF types availableSpecifications Symbol Value Unit Average Forward Rec...
1N484B: Features: ·Humidity proof glass·Thermally matched system·No thermal fatigue·No applications restrictions·Sigma BondTM plated contacts·100% guaranteed solderability·Problem free assembly·Six Sigma qu...
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Symbol | Value | Unit | |
Average Forward Rectified Current at TAmbient = 25 °C |
IAV | 0.65 | Amp |
Maximum Non-Repetitive Surge (8.3 mSecs. 1/2 sine) | IFSM | 2.0 | Amps |
Junction Temperature Range | Tj | -65 to +200 | °C |
Storage Temperature Range | Ts | -55 to +200 | °C |
Max. Average Power Dissipation | Pdiss | 250 | mW |
Used as a general purpose diode 1N484B in power supplies, or in clipping and steering applications. Operation of 1N484B at temperatures up to 200 degrees C, no derating. 1N484B can be used in harsh environments where hermeticity and low cost are important.Compatible with all major automatic pick and place mounting ceramic boards along with high temperature IR equipment. May be used on solder reflow.