1N5804

Features: · Chip Outline Dimensions: 41 x 41 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 50,000Ã Nominal· Bonding Area: 23 x 23 mils Min.· Back Metallization: Gold· Junction Passivated with Thermal Silicon Dioxide - Planar Design· Backside Ava...

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1N5804 Picture
SeekIC No. : 004213474 Detail

1N5804: Features: · Chip Outline Dimensions: 41 x 41 mils· Chip Thickness: 8 to 12 mils· Anode Metallization: Aluminum· Metallization Thickness: 50,000Ã Nominal· Bonding Area: 23 x 23 mils Min.· Back...

floor Price/Ceiling Price

Part Number:
1N5804
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

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evaluate  (4.8 stars)

Upload time: 2024/4/26

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Product Details

Description



Features:

· Chip Outline Dimensions: 41 x 41 mils
· Chip Thickness: 8 to 12 mils
· Anode Metallization: Aluminum
· Metallization Thickness: 50,000Ã Nominal
· Bonding Area: 23 x 23 mils Min.
· Back Metallization: Gold
· Junction Passivated with Thermal Silicon Dioxide - Planar Design
· Backside Available with Solderable Ag Backside as JANHCF or JANKCF





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