BOARD LEVEL HEAT SINK
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| Capacitance : | 16.5 pF | Series: | - |
| Manufacturer: | Aavid Thermalloy | Type: | Board Level |
| Package Cooled: | BGA | Attachment Method: | Thermal Tape, Adhesive (Not Included) |
| Shape: | Square | Length: | 0.655" (16.64mm) |
| Width: | 0.655" (16.64mm) | Diameter: | - |
| Height Off Base (Height of Fin): | 0.265" (6.73mm) | Power Dissipation @ Temperature Rise: | 1W @ 40°C |
| Thermal Resistance @ Forced Air Flow: | 17.5°C/W @ 300 LFM | Thermal Resistance @ Natural: | - |
| Material: | Aluminum |
| Technical/Catalog Information | 2283B |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Height | 0.265" (6.73mm) |
| Material | Aluminum |
| Package Cooled | - |
| Power Dissipation @ Temperature Rise | 1W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 17.5°C/W @ 300 LFM |
| Outline | 16.64mm x 16.64mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Other Names | 2283B 2283B |