232266197

Features: • Ideal for pick-and-place circuit assembly• Low mounting height• Suitable for reflow soldering• Small ceramic diameter for faster response• Low heat transfer to substrate• Flat terminations for stable positioning and good solderability.ApplicationR...

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232266197 Picture
SeekIC No. : 004216255 Detail

232266197: Features: • Ideal for pick-and-place circuit assembly• Low mounting height• Suitable for reflow soldering• Small ceramic diameter for faster response• Low heat transfer...

floor Price/Ceiling Price

Part Number:
232266197
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

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Upload time: 2024/4/28

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Product Details

Description



Features:

• Ideal for pick-and-place circuit assembly
• Low mounting height
• Suitable for reflow soldering
• Small ceramic diameter for faster response
• Low heat transfer to substrate
• Flat terminations for stable positioning and good solderability.



Application

•Telecom
Central office switching (C.O.)
Subscriber terminal equipment (T.E.)
Set top box
Modems
Cable TV communications
•General industry and automotive
Low power supplies overload protection
Data bus protection.



Description

The 232266197 consists of a high-performance PTC ceramic disc mounted in a lead-frame for direct soldering onto a printed-circuit board (PCB) or substrate.
232266197 is soldered to the leadframe by a local reflow process, during which the solder layer is melted to the metallized ceramic surface using a low residue flux.




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