HEATSINK BGA W/CLIP
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| Technical/Catalog Information | 2522B-EP04-BGS5G |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Clip |
| Height | 0.4" (10.16mm) |
| Material | - |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 7.0°C/W @ 200 LFM |
| Outline | 38.10mm x 38.10mm |
| Thermal Resistance @ Natural | 22°C/W |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 2522B EP04 BGS5G 2522BEP04BGS5G |