Features: High-coupled rated output power up to 280 mW, CW Wide environmental range Field-proven packaging technology InGaAsP/InP high-power, strained multiple quantum- well (MQW) chip design Internal optical isolator (optional) Internal thermoelectric cooler (TEC) InGaAs PIN photodetector back-fa...
269-Type: Features: High-coupled rated output power up to 280 mW, CW Wide environmental range Field-proven packaging technology InGaAsP/InP high-power, strained multiple quantum- well (MQW) chip design Intern...
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Parameter |
Symbol |
Min |
Max |
Unit |
Operating |
TC |
0 |
75 |
|
|
Tstg |
40 |
85 |
|
Laser Forward Bias (TEC on): |
IF |
|
1900 |
mA |
Laser Reverse Voltage |
VR |
- |
2 |
V |
Photodiode Reverse Voltage |
VRMON |
- |
20 |
V |
TEC Current |
ITEC |
- |
2.2 |
A |
TEC Voltage |
VTEC |
- |
5.0 |
V |
Temperature Sensor Current |
ITS |
- |
5 |
mA |
Laser Diode Operating Chip Temperature |
TLD |
- |
40 |
°C |