2FAE-C15R

Features: · Lead free versions available· RoHS compliant (lead free version)*· Bidirectional EMI filtering· ESD protection· Protects 6 data linesApplication· Cell phones· PDAs and notebooks· Digital cameras· MP3 players and GPSDescriptionThe 2FAE-C15R device, manufactured using Thin Film on Silico...

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2FAE-C15R Picture
SeekIC No. : 004218586 Detail

2FAE-C15R: Features: · Lead free versions available· RoHS compliant (lead free version)*· Bidirectional EMI filtering· ESD protection· Protects 6 data linesApplication· Cell phones· PDAs and notebooks· Digital...

floor Price/Ceiling Price

Part Number:
2FAE-C15R
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/4/29

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Product Details

Description



Features:

· Lead free versions available
· RoHS compliant (lead free version)*
· Bidirectional EMI filtering
· ESD protection
· Protects 6 data lines



Application

· Cell phones
· PDAs and notebooks
· Digital cameras
· MP3 players and GPS



Description

The 2FAE-C15R device, manufactured using Thin Film on Silicon technology, provides ESD protection and EMI filtering for the data port of portable electronic devices such as cell phones, modems and PDAs. The device incorporates six low pass filter channels where each channel has a series 100 ohm resistor assuring a minimum of -30 dB attenuation from 800 MHz to 3 GHz. The device is suitable for EMI filtering of GSM, CDMA, W-CDMA, WLAN and Bluetooth frequencies.

Each internal and external port of the six channels includes a TVS diode for ESD protection. The ESD protection provided by the component enables a data port to withstand a minimum ±8 KV Contact / ±15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. 2FAE-C15R measures 1.33 mm x 2.96 mm and is available in a 15 bump CSP package intended to be mounted directly onto an FR4 printed circuit board. The CSP device meets typical thermal cycle and bend test specifications without the use of an underfill material.




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