2FAF-C10R

Features: Lead free versions available RoHS compliant (lead free version)* Bidirectional EMI filtering ESD protection > 25 k volts Protects 4 data linesApplication Cell phones PDAs and notebooks Digital cameras MP3 players and GPSDescriptionThe 2FAF-C10R device, manufactured using Thin Film on...

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2FAF-C10R Picture
SeekIC No. : 004218587 Detail

2FAF-C10R: Features: Lead free versions available RoHS compliant (lead free version)* Bidirectional EMI filtering ESD protection > 25 k volts Protects 4 data linesApplication Cell phones PDAs and notebooks...

floor Price/Ceiling Price

Part Number:
2FAF-C10R
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/4/29

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Product Details

Description



Features:

Lead free versions available
RoHS compliant (lead free version)*
Bidirectional EMI filtering
ESD protection > 25 k volts
Protects 4 data lines



Application

Cell phones
PDAs and notebooks
Digital cameras
MP3 players and GPS



Description

The 2FAF-C10R device, manufactured using Thin Film on Silicon technology, provides ESD protection and EMI filtering for the data ports of portable electronic devices such as cell phones, modems and PDAs. The device incorporates four low pass filter channels where each channel has a series 100 ohm resistor assuring a minimum of 28 dB attenuation from 800 MHz to 3 GHz. The device is suitable for EMI filtering of GSM, CDMA, W-CDMA, WLAN and Bluetooth frequencies.

Each internal and external port of the four channels includes a TVS diode for ESD protection. The ESD protection provided by the component enables a data port to withstand a minimum ±8 KV Contact / ±15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. 2FAF-C10R measures 1.33 mm x 2 mm and is available in a 10 bump CSP package intended to be mounted directly onto an FR4 printed circuit board. The CSP device meets typical thermal cycle and bend test specifications without the use of an underfill material.




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