2FAN-C5R

Features: Lead free versions available RoHS compliant (lead free version)* Bidirectional EMI filtering ESD protection Protects two audio linesApplication Cell phones PDAs and notebooks Digital cameras MP3 players and GPSDescriptionThe 2FAN-C5R device, manufactured using Thin Film on Silicon techn...

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SeekIC No. : 004218597 Detail

2FAN-C5R: Features: Lead free versions available RoHS compliant (lead free version)* Bidirectional EMI filtering ESD protection Protects two audio linesApplication Cell phones PDAs and notebooks Digital came...

floor Price/Ceiling Price

Part Number:
2FAN-C5R
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2024/4/29

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Product Details

Description



Features:

Lead free versions available
RoHS compliant (lead free version)*
Bidirectional EMI filtering
ESD protection
Protects two audio lines



Application

Cell phones
PDAs and notebooks
Digital cameras
MP3 players and GPS



Description

The 2FAN-C5R device, manufactured using Thin Film on Silicon technology, provides ESD protection and EMI filtering for the audio port of portable electronic devices such as cell phones, modems and PDAs. The device incorporates two low pass filter channels where each channel has a series 68 ohm resistor assuring a minimum of -25 dB attenuation from 800 MHz to 3 GHz. The device is suitable for EMI filtering of GSM, CDMA, W-CDMA,WLAN and Bluetooth frequencies.

Each internal and external port of the two channels includes a TVS diode for ESD protection. The ESD protection provided by the component enables a data port to withstand a minimum ±8 KV Contact / ±15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. 2FAN-C5R measures 1.00 mm x 1.33 mm and is available in a 5 bump CSP package intended to be mounted directly onto an FR4 printed circuit board. The CSP device meets typical thermal cycle and bend test specifications without the use of an underfill material.




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