Features: • Low On-Resistance R DS(on)1 = 27 m Max. (VGS = 10 V, ID = 18 A) R DS(on)2 = 40 m Max. (VGS = 4 V, ID = 18 A)• Low Ciss Ciss =1 200 pF Typ.• Built-in G-S Protection Diode• Isolated TO-220 packageSpecificationsDrain to Source Voltage VDSS ............................
2SK2724: Features: • Low On-Resistance R DS(on)1 = 27 m Max. (VGS = 10 V, ID = 18 A) R DS(on)2 = 40 m Max. (VGS = 4 V, ID = 18 A)• Low Ciss Ciss =1 200 pF Typ.• Built-in G-S Protection Diod...
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Features: High Speed SwitchingLow On-ResistanceNo Secondary BreakdownLow Driving PowerHigh Voltage...
Features: - High Speed Switching- Low On-Resistance- No Secondary Breakdown- Low Driving Power- Hi...
Drain to Source Voltage VDSS ............................60 V
Gate to Source Voltage VGSS ...........................±20 V
Drain Current (DC) I D(DC) ............................±35 A
Drain Current (Pulse)* I D(pulse) .........................±140 A
Total Power Dissipation (TA = 25 °C) PT .....................2.0 W
Total Power Dissipation (TC = 25 °C) PT ......................30 W
Channel Temperature Tch ............................150 °C
Storage Temperature Tstg .......................55 to +150 °C
* PW 10 s, Duty Cycle 1 %
The diode connected between the gate and source of the transistor serves as a protector against ESD. When this device actually used, an additional otection circuit is externally required if voltage exceeding the rated voltage may be applied to this device.