Features: Application• Small gate charge: Qg = 60 nC (typ.)• Fast reverse recovery time: trr = 380 ns (typ.)• Low drain-source ON-resistance: RDS (ON) = 0.2 (typ.)• High forward transfer admittance: |Yfs| = 16.5 S (typ.)• Low leakage current: IDSS = 500 A (VDS = 500 ...
2SK3936: Features: Application• Small gate charge: Qg = 60 nC (typ.)• Fast reverse recovery time: trr = 380 ns (typ.)• Low drain-source ON-resistance: RDS (ON) = 0.2 (typ.)• High for...
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| Characteristic | Symbol | Rating | Unit | |
| Drainsource voltage | VDSS | 500 | V | |
| Draingate voltage (RGS = 20 k) | VDGR | 500 | V | |
| Gatesource voltage | VGSS | ±30 | V | |
| Drain current | DC (Note 1) | ID | 23 | A |
| Pulse (Note 1) | IDP | 92 | A | |
| Drain power dissipation (Tc = 25) | PD | 150 | W | |
| Single-pulse avalanche energy (Note 2) |
EAS | 759 | mJ | |
| Avalanche current | IAR | 23 | A | |
| Repetitive avalanche energy (Note 3) | EAR | 15 | mJ | |
| Channel temperature | Tch | 150 | ||
| Storage temperature range | Tstg | −55~150 | ||
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).