Features: SpecificationsDescriptionThe 3216FF is designed as one kind of subminiature surface mount fuses,features of the 3216FF are:(1)catalog symbol: 3216FF;(2)voltage rating:32 Volt AC, 63 Volt DC (250mA-3A),32 Volt AC, 32 Volt DC (4-6.5A);(3)interrupting rating: 50 amperes;(4)physical size::EI...
3216FF: Features: SpecificationsDescriptionThe 3216FF is designed as one kind of subminiature surface mount fuses,features of the 3216FF are:(1)catalog symbol: 3216FF;(2)voltage rating:32 Volt AC, 63 Volt D...
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The 3216FF is designed as one kind of subminiature surface mount fuses,features of the 3216FF are:(1)catalog symbol: 3216FF;(2)voltage rating:32 Volt AC, 63 Volt DC (250mA-3A),32 Volt AC, 32 Volt DC (4-6.5A);(3)interrupting rating: 50 amperes;(4)physical size::EIA SOCM-3216AC (Equivalent to 1206),3.2 x 1.6 x 0.90mm,0.126 x 0.063 x 0.035 in;(5)time-current characteristics:fast acting fuse: will carry 100% of rated current for a minimum of 4 hours, and will open within 5 seconds at 250% of rated current (250mA-3A),the 4-6.5A fuses will open within 1 second at 350% of rated current;(6)agency approvals:UL recognized, std. CSA certified:1.5-3A-file 53787, class 1422-01,CSA component acceptance 250mA,1A, 4-6.5A-File 53787, class 1422-30.
Here are the general information about this 3216FF:(1)bussmann SMT chip fuses utilize thick and thin metal film technologies for superior fusing action and enhanced reliability.;(2)The fuse element is bonded to a ceramic substrate and encapsulated with glass, providing excellent short-circuit performance and environmental integrity. Predicted reliability of the 1608FF chip fuse is 30 times greater than that of the typical chip capacitor (consult Bussmann for details);(3)the end terminations are over-plated with nickel and tin-lead and the last one (4)substrate and coating thermal expansion coefficients are closely matched to that of FR-4 epoxy-glass circuit board for superior solder joint reliability.
The most important one is the absolute maximum ratings of 3216FF:(1)operating temperature range:-55 to +125°C, with proper derating;(2)thermal shock:MIL-STD-202, Method 107, Test Condition B (-65 to 125°C), 1000 cycles, fuses soldered to FR-4 glass -epoxy circuit board;(3)vibration:MIL-STD-202, Method 204, Test Condition C (55 to 2000 HZ, 10G);(4)solderability:withstands 60 seconds above 200°C, 260°C maximum;(5)moisture resistance:MIL-STD-202, Method 106, 10 day cycle;(6)solder leach resistance & terminal adhesion:EIA-576 (30 seconds submersion in 260°C tin-lead solder).