3216LV

The 3216LV is designed as one kind of subminiature surface mount fuses with 125 AC/DC.The subminiature surface mount fuses utilize thick and thin metal film technologies for superior fusing action and enhanced reliability;The fuse element is bonded to a ceramic substrate and encapsulated with glass, providing excellent short-circuit performance and environmental integrity. Predicted reliability of the 3216LV chip fuse is 30 times greater than that of the typical chip capacitor (consult Bussmann for details) and substrate and coating thermal expansion coefficients are closely matched to that of FR-4 epoxy-glass circuit board for superior solder joint reliability.

The absolute maximum ratings of 3216LV can be summarized as:(1)operating temperature range:-65 to +125°C, with proper derating;(2)thermal shock:MIL-STD-202, method 107, test condition B (-65 to 125°C),1000 cycles, fuses soldered to FR-4 glass-epoxy circuit board;(3)vibration:MIL-STD-202, method 204, test condition C (55 to 2000 HZ, 10G);(4)solderability:withstands 60 seconds above 200°C, 260°C maximum;(5)moisture resistance:MIL-STD-202, method 106, 10 day cycle;(6)solder leach resistance & terminal adhesion:EIA-576 (30 seconds submersion in 260°C tin-lead solder).

The only controlled copy of this BIF document is the electronic read-only version located on the Bussmann Network Drive. All other copies of this BIF document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Bussmann reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Bussmann also reserves the right to change or update, without notice, any technical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.