33781

Notes
1. ESD1 testing is performed in accordance with the Human Body Model (HBM) (C_ZAP = 100pF, R_ZAP = 1500); ESD2 testing is performed in accordance with the Machine Model (MM) (C_ZAP = 200pF, R_ZAP = 0); and Charge Body Model (CBM).
2. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device.
3. Freescale's Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

The 33781 is a master device for four differential DSI 2.02 buses. It contains the logic to interface the buses to a standard serial peripheral interface (SPI) port and the analog circuitry to drive data and power over the bus, as well as receive data from the remote slave devices.

The differential mode of the 33781 generates lower electromagnetic interference (EMI) in situations where data rates and wiring make this a problem. Frequency spreading further reduces interference by spreading the energy across many frequencies, reducing the energy in any single frequency.