THIN FIN HEAT SINK
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| Technical/Catalog Information | 342000F00000 |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Included) |
| Height | - |
| Material | Copper |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | - |
| Thermal Resistance @ Forced Air Flow | 8.0°C/W @ 200 LFM |
| Outline | 101.60mm x 25.40mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Contains Lead |
| RoHS Status | RoHS Non-Compliant |
| Other Names | 342000F00000 342000F00000 |