BGA HEAT SINK
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| Technical/Catalog Information | 364424B00000G |
| Vendor | Aavid Thermalloy |
| Category | Thermal Management |
| Attachment Method | Thermal Tape, Adhesive (Not Included) |
| Height | 0.45" (11.43mm) |
| Material | Aluminum |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
| Power Dissipation @ Temperature Rise | 2W @ 40°C |
| Thermal Resistance @ Forced Air Flow | 6.0°C/W @ 200 LFM |
| Outline | 40.00mm x 40.00mm |
| Thermal Resistance @ Natural | - |
| Lead Free Status | Lead Free |
| RoHS Status | RoHS Compliant |
| Other Names | 364424B00000G 364424B00000G |